The Raise3D DF2 Solution stands out as a comprehensive Digital Light Printing (DLP) solution, delivering swift printing, sleek surfaces, intricate details, and impressive reliability. Specifically tailored for engineering prototyping, manufacturing aids, and low-volume production, it offers a wide range of high-performance engineering resins. The incorporation of RFID technology guarantees a traceable workflow across the complete print, wash, and cure process, thereby minimizing labor time and cutting costs.


Print Technology: Digital Light Printing (DLP)
Build Size: (W × D × H): 200 × 112 × 300 mm (7.87 × 4.41 × 11.8 inch)
XY Resolution: 2560 x 1440
Max Part Weight: 10 kg
Max Printing Speed: 25 mm/h (0.1 mm per layer)
Layer Height: 50-100 micron
Resin Management: Auto Resin Feeding, Resin Level Detection, Resin Confirmation
Control Panel: Touch Screen (Resolution: 1920 × 720) with Magic Layout (Allow to easily adjust the print layout and duplicate prints)
CRFID Print Platform: Record the type of resin used and the printing, washing and curing settings
Level Calibration: Calibrated in factory
Chamber Heating: Max 40℃
Raise3D Resins: Raise3D Standard White Resin, Raise3D High Detail Apricot Resin, Raise3D Tough 2K Grey Resin, Raise3D Rigid 3K Grey Resin, Raise3D High Clear Resin (Coming soon), Raise3D High Temperature Resin (Coming soon)
Co-branding Resins with BASF and Henkel: LOCTITE 3D IND405™, LOCTITE 3D PRO476™, Ultracur3D® RG 3280, Ultracur3D® RG 1100 B ORP
(Open Resin Program): Coming soon

Start printing your own metal parts today

Talk to our experts via Online consultation and request for a demo